 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| YZB-4 DBV-6 www.ti.com PW-8 P-8 SN65220 SN65240 SN75240 SLLS266F - FEBRUARY 1997 - REVISED JULY 2004 USB PORT TRANSIENT SUPPRESSORS FEATURES D Design to Protect Submicron 3-V or 5-V D Port ESD Protection Capability Exceeds: D D D D - 15-kV Human Body Model - 2-kV Machine Model Available in a WCSP Chip-Scale Package Stand-Off Voltage . . . 6.0 V Min Low Current Leakage . . . 1 A Max at 6 V Low Capacitance . . . 35 pF Typ SN65220DBV (TOP VIEW) NC GND NC 1 6 A GND B SN65220YZB (Size: 925 mm x 925 mm +6 mm) (TOP VIEW) A B GND GND Circuits from Noise Transients APPLICATIONS D USB 1.1 Host, Hub, or Peripheral Ports SADI 2 3 5 4 A1 B1 A2 B2 DESCRIPTION The SN65220 is a single transient voltage suppressor and the SN65240 and SN75240 are dual transient voltage suppressors designed to provide electrical noise transient protection to Universal Serial Bus (USB) 1.1 ports. Note that the input capacitance of the device makes it unsuitable for high-speed USB 2.0 applications. Any cabled I/O can be subjected to electrical noise transients from various sources. These noise transients can cause damage to the USB transceiver and/or the USB ASIC if they are of sufficient magnitude and duration. USB ports are typically implemented in 3-V or 5-V digital CMOS with very limited ESD protection. The SN65220, SN65240, and SN75240 can significantly increase the port ESD protection level and reduce the risk of damage to the circuits of the USB port. The IEC1000-4-2 ESD performance of the SN65220, SN65240, and SN75240 is measured at the system level. Therefore, system design impacts the results of these tests. A high compliance level may be attained with proper board design and layout. EQUIVALENT SCHEMATIC DIAGRAM A or C NC - No internal connection When read horizontally, Pin 1 is the bottom left pin. SN65240P SN65240PW , SN75240P SN75240PW , (TOP VIEW) GND C GND D 1 2 3 4 8 7 6 5 A GND B GND CURRENT vs VOLTAGE 7.5 5 2.5 Current - A 0 -2.5 -5 -7.5 GND -10 -10 -5 0 5 10 15 Voltage - V B or D (One Suppressor Shown) NOTE: All GND terminals should be connected to ground. NOTE A: Typical current versus voltage curve was derived using the IEC 1.2/50-s surge waveform. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 1997 - 2003, Texas Instruments Incorporated SN65220 SN65240 SN75240 SLLS266F - FEBRUARY 1997 - REVISED JULY 2004 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. IEC1000-4-2 COMPLIANCE LEVEL MAXIMUM TEST VOLTAGE IEC1000-4-2 COMPLIANCE LEVEL 1 2 3 4 CONTACT DISCHARGE (kV) 2 4 6 8 AIR DISCHARGE (kV) 2 4 8 15 PACKAGE/ORDERING INFORMATION PRODUCT SUPRESSORS TA PACKAGE WCSP-4 SN65220 1 -40C to 85C SOT23-6 DIP-8 SN65240 2 -40 C 85 C -40C to 85C TSSOP-8 DIP-8 SN75240 2 0 C 70 C 0C to 70C TSSOP-8 DBV P PW P PW A75240 A65240 PACKAGE DESIGNATOR YZB MARKED AS NWP or 65220 SADI ORDER NUMBER SN65220YZBR (Reel) SN65220YZBT (Mini Reel) SN65220DBVR (Mini Reel) SN65220DBVT (Mini Reel) SN65240P (Rail) SN65240PW (Rail) SN65240PWR (Reel) SN75240P (Rail) SN75240PW (Rail) SN75240PWR (Reel) ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNIT Continuous power dissipation Electrostatic discharge Peak power dissipation, PD(peak) Peak forward surge current, IFSM Peak reverse surge current, IRSM See Dissipation Rating Table 15 kV(2), 2 kV(3) 60 W 3A -9 A Storage temperature range, Tstg -65C to 150C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Human Body Model - Tested in accordance with JEDEC Standard 22, Test Method A114-A. (3) Charged Device Model - Tested in accordance with JEDEC Standard 22, Test Method C101. 2 www.ti.com SN65220 SN65240 SN75240 SLLS266F - FEBRUARY 1997 - REVISED JULY 2004 DISSIPATION RATING TABLE PACKAGE DBV P TA 25C POWER RATING 385 mW 1150 mW DERATING FACTOR ABOVE TA = 25C 3.1 mW/C 9.2 mW/C TA = 70C POWER RATING 246 mW 736 mW TA = 85C POWER RATING 200 mW 598 mW PW 520 mW 4.2 mW/C 331 mW 268 mW This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. recommended operating conditions MIN SN75240 Operating free-air temperature, TA SN65220, SN65240 0 -40 MAX 70 85 UNIT C electrical characteristics over recommended operating conditions (unless otherwise noted) PARAMETER Ilkg V(BR) CIN Leakage current Breakdown voltage Input capacitance to ground TEST CONDITIONS VI = 6 V at A, B, C, or D terminals VI = 1 mA at A, B, C, or D terminals VI = 0.4 sin (4E6t) + 0.5 V MIN 6.5 TYP 7 35 MAX 1 8 UNIT A V pF APPLICATION INFORMATION Full-Speed or Low-Speed USB Host-or-Hub Port Transceiver 27 A 15 k 15 k 27 GND SN75220 or 1/2 SNx5240 B D- D+ D+ A SN75220 or 1/2 SNx5240 D- B GND 1.5 k (Low Speed Only) 27 Full-Speed or Low-Speed USB Down Stream Transceiver 27 1.5 k (Full Speed Only) 3 PACKAGE OPTION ADDENDUM www.ti.com 1-Mar-2005 PACKAGING INFORMATION Orderable Device SN65220DBVR SN65220DBVT SN65220YZBR SN65220YZBT SN65240P SN65240PW SN65240PWR SN75240P SN75240PW SN75240PWLE SN75240PWR SN75240PWRG4 (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE PREVIEW Package Type SOT-23 SOT-23 DSBGA DSBGA PDIP TSSOP TSSOP PDIP TSSOP TSSOP TSSOP TSSOP Package Drawing DBV DBV YZB YZB P PW PW P PW PW PW PW Pins Package Eco Plan (2) Qty 6 6 4 4 8 8 8 8 8 8 8 8 2000 2000 3000 Green (RoHS & no Sb/Br) 250 3000 250 50 150 2000 50 150 Green (RoHS & no Sb/Br) None None Pb-Free (RoHS) None None Pb-Free (RoHS) None None None None Lead/Ball Finish CU NIPDAU CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU Call TI MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-NC-NC-NC Level-1-220C-UNLIM Level-1-220C-UNLIM Level-NC-NC-NC Level-1-220C-UNLIM Call TI Level-1-220C-UNLIM Call TI The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDI001A - JANUARY 1995 - REVISED JUNE 1999 P (R-PDIP-T8) 0.400 (10,60) 0.355 (9,02) 8 5 PLASTIC DUAL-IN-LINE 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.015 (0,38) 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.010 (0,25) NOM Gage Plane 0.020 (0,51) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M 0.430 (10,92) MAX 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) 14 PINS SHOWN PLASTIC SMALL-OUTLINE PACKAGE 0,65 14 8 0,30 0,19 0,10 M 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 7 0- 8 0,75 0,50 Seating Plane 1,20 MAX 0,15 0,05 0,10 PINS ** DIM A MAX 8 14 16 20 24 28 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless This datasheet has been download from: www..com Datasheets for electronics components. |
Price & Availability of SN65220DBVR
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |